This facility is a device that vision aligns driving IC (COF) & FPC to the panel and thermally compresses it to drive the panel.

COF, FOF, COG, FOG, T-FOG, U-FPC, LASER, SIDE BONDER

Automated equipment that attaches and inspects (aligns, indents) the PCB on the supplied panel using a hot bar in an accurate position through each mark recognition

PCB, FOB BONDER

Automated equipment that inspects the degree of alignment after bonding COF and FPCB to the back of the MICRO LED Glass substrate via ACF

FOG BONDER